TSMC Board Greenlights Q2 Results, NT$7 Dividend, $29.4B Capex, and Sony JV
TSM sits 89% above its 52-week low of $223.7.
Summary
TSMC's board approved Q2 2026 earnings, a NT$7.0 per share dividend, US$29.4 billion in capital expenditures, and a new joint venture with Sony for image sensors. The joint venture agreement was subsequently signed, with Sony contributing about ¥465 billion and TSMC about ¥282 billion, and volume production expected in 2029.
Updated with an SEC 6-K filing · What changed
Updates
· SEC 6-K — TSMC and Sony signed a definitive agreement for the Advanced Vision Semiconductor Manufacturing JV in Koshi City, Kumamoto. Sony will contribute about ¥465 billion and TSMC about ¥282 billion, with volume production expected in 2029.
Key Events · Earnings and Guidance · TSM
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Updated · · SEC 6-K
Sony Joint Venture for Image Sensors
The formation of a new joint venture with Sony Semiconductor Solutions for next-generation image sensors was approved, with an investment of up to ¥282 billion. A definitive agreement was subsequently signed for the Advanced Vision Semiconductor Manufacturing JV in Koshi City, Kumamoto, with Sony contributing about ¥465 billion and TSMC about ¥282 billion, and volume production expected in 2029.
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Q2 2026 Financials Approved
The board approved Q2 2026 consolidated revenue of NT$1,270.38 billion and net income of NT$706.56 billion, with diluted EPS of NT$27.25.
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NT$7.0 Per Share Cash Dividend
A NT$7.0 per share cash dividend was declared for Q2 2026, with the ex-dividend date set for December 10, 2026 and payment on January 7, 2027.
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US$29.44 Billion Capex Plan
Capital appropriations of approximately US$29.44 billion were approved for advanced technology capacity, advanced packaging, mature/specialty technology, and fab construction.
Analysis · TSM · Manufacturing
The board signed off on Q2 2026 results, with net income reaching NT$706.6 billion on revenue of NT$1.27 trillion, and declared a NT$7.0 per share cash dividend. In a move that underscores the company's aggressive capacity buildout to meet surging AI and high-performance computing demand, nearly US$29.4 billion in capital expenditures was approved to expand advanced technology and packaging capacity. A new joint venture with Sony for next-generation image sensors, backed by an investment of up to ¥282 billion, signals deeper collaboration in imaging technology. The joint venture agreement was subsequently signed, with Sony contributing about ¥465 billion and TSMC about ¥282 billion, and volume production expected in 2029. Shareholders can expect the dividend payment in January 2027.
How filings like this one have moved
In the 30 days to Sep 30, 2026, 34.9% of the 1020 measured filings Wiseek scored 8 moved their stock by 5% or more by the next session's close. The median move was -0.54%. These are measured outcomes after filings of this importance, not a forecast for this one.
Measured one observation per ticker per day, after exclusions. Current figures: Filing Impact Tracker · open dataset
At the time of this filing, TSM was trading at $423.00 on NYSE in the Manufacturing sector, with a market capitalization of approximately $1.9T. The 52-week trading range was $223.70 to $479.00. This filing was assessed with positive market sentiment and an importance score of 8 out of 10.