ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells integrated circuits, along with providing related assembly and testing services. The company operates in Taiwan, Japan, the People's Republic of China, and internationally. Its business is structured into five segments: Testing; Assembly; Display Panel Driver Semiconductor Assembly and Testing; Bumping; and Others. ChipMOS offers various leadframe-based packages, including the small outline package, thin small outline package, and quad flat package. It also provides substrate-based packages such as FBGA, VFBGA, stacked chip-scale package, TFBGA, LGA, COG, and COF. The company's testing solutions encompass professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot run arrangement, engineering support, device failure mode analysis, and automation systems for simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC devices. Additionally, ChipMOS provides bumping services, intellectual property management and enabling technologies, and turnkey services. These turnkey services include wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment for display driver IC, memory IC, and logic mixed-signal IC. The company serves fabless companies, integrated device manufacturers, and foundries. ChipMOS TECHNOLOGIES INC. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.