FORMFACTOR INC

General FormFactor, Inc. is a leading provider of electrical and optical test and measurement technologies for the entire semiconductor product lifecycle, including characterization, modeling, reliability, design de-bug, qualification, and production testing. The company offers a wide range of high-performance probe cards, analytical probes, probe stations, thermal systems, and cryogenic systems to both semiconductor companies and scientific institutions. These products deliver electrical and optical information from various semiconductor and electro-optical devices and integrated circuits, from early research through development to high-volume production. Customers utilize these products and services to enhance profitability by optimizing device performance, reducing waste, and improving yields. Founded in 1993, the company launched its first product in 1995. General FormFactor, Inc. has acquired businesses to expand its operations into a semiconductor test and measurement market leader, increasing its scale, diversification, breadth, and market opportunities from Lab to Fab. As of December 27, 2025, the company operates in two reportable segments: the Probe Cards segment and the Systems segment. The Probe Cards segment includes sales of probe cards and analytical probes, while the Systems segment includes sales of probe stations, thermal systems, and cryogenic systems. The company designs, manufactures, and sells multiple product lines, including probe cards, analytical probes, probe stations, thermal systems, cryogenic systems, and related services. Probe cards incorporate various technologies and product architectures, including micro-electromechanical systems (MEMS) technologies. Advanced design and automation technologies are used to enable rapid and cost-effective manufacturing of resilient composite contact elements with characteristic length scales of a few microns. These contact elements are engineered to apply a specific range of forces on and across a chip's bond pad, solder bump, micro-bump, through-silicon-via (TSV), or copper pillar during the test process, and to maintain their shape and position across various compression levels.