Amtech Systems, Inc.

OUR COMPANY provides equipment, consumables, and services for semiconductor device packaging, wafer production, and device fabrication. Our products are used to fabricate and package semiconductor devices, including graphic processing units (GPUs) for AI applications, silicon carbide (SiC) and silicon (Si) power devices, and other optical, analog, and digital devices. We sell these products globally to semiconductor device packaging, electronic assembly, and device fabrication companies. Our business is organized into two reportable segments. The Thermal Processing Solutions segment includes conveyorized reflow equipment for advanced semiconductor packaging and electronic assembly, high-temperature conveyorized furnaces for power semiconductor substrate and electronic components manufacturing, and diffusion furnaces for SiC and Si power device production. This segment is comprised of BTU, a Delaware corporation acquired in January 2015, with operations in China, Malaysia, and the UK. The Semiconductor Fabrication Solutions segment includes consumables, equipment, and services for wafer polishing, dicing, and cleaning. This segment includes PR Hoffman, an Arizona corporation acquired in July 1997; Advanced Compound Materials, Inc., a Delaware corporation founded in 2023; Intersurface Dynamics, a Connecticut corporation acquired in March 2021; and Entrepix, an Arizona corporation acquired in January 2023. We focus on semiconductor and related processes and markets, with products used in both early and late stages of semiconductor and electronics manufacturing.