Amkor Technology, Inc.

Amkor is the world's largest U.S. headquartered outsourced semiconductor assembly and test service provider (OSAT) and a global leader in outsourced semiconductor packaging and test services. The company provides high-quality solutions to semiconductor and electronics companies, enabling them to bring advanced technologies to market. Amkor's comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions for applications such as smartphones, data centers, artificial intelligence, automobiles, and wearables. Amkor designs and develops innovative packaging and test technologies, focusing on advanced packaging solutions in key markets like artificial intelligence. The company has expertise in high-volume manufacturing processes and operates a geographically diverse base with manufacturing facilities in multiple countries, including the United States, where the Arizona Facility is under construction. Amkor's packaging and test services meet application and chip-specific requirements, including interconnect technology type, size, thickness, and electrical, mechanical, and thermal performance. The company offers turnkey packaging and test services, including wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system level and final test, and drop shipment services. Amkor serves integrated device manufacturers (IDMs), "fabless" semiconductor companies, original equipment manufacturers (OEMs), and contract foundries. By offering a broad package portfolio, Amkor allows IDMs to outsource packaging and test services and focus investments on core competencies like silicon fabrication.