AEHR TEST SYSTEMS

AEHR TEST SYSTEMS provides test solutions for semiconductor devices. Incorporated in California on May 25, 1977, and headquartered in Fremont, California, the company offers systems for testing, burning-in, and stabilizing semiconductors at the wafer level, as singulated die, and at the package level. Thousands of these systems have been installed globally. The company's products address the increasing quality, reliability, safety, and security demands for semiconductors in mission-critical applications. These applications include artificial intelligence (AI), High Performance Compute (HPC) data centers, E-mobility (electric vehicles), electric vehicle charging infrastructure, solar and wind power, data and telecommunications infrastructure, and solid-state memory storage. AEHR TEST SYSTEMS has developed products such as the FOX-P family of test and burn-in systems, the FOX WaferPak Aligner, FOX WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The FOX-XP and FOX-NP systems are designed for full wafer contact and singulated die/module test and burn-in, accommodating devices like silicon carbide-based and gallium nitride power semiconductors, 2D and 3D sensors, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost, single-wafer compact test solution for logic, memory, and photonic devices. The FOX WaferPak Contactor allows testing of wafers up to 300mm, enabling integrated circuit (IC) manufacturers to perform test, burn-in, and stabilization of full wafers on FOX-P systems. The FOX DiePak Carrier facilitates testing, burn-in, and stabilization of singulated bare die and modules, supporting up to 1,024 devices in parallel per DiePak on FOX-NP and FOX-XP systems, with up to nine DiePaks simultaneously.