ACM Research, Inc.

The company supplies advanced, innovative capital equipment for the global semiconductor industry. Its products address yield-critical and performance-sensitive process steps in semiconductor manufacturing, focusing on effective particle removal, uniform material deposition, and reliable process control. These solutions are designed to manage cost of ownership, throughput, and environmental considerations. The company's wet-cleaning, plating, furnace, PECVD, track, and other front-end processing equipment are used by fabricators of advanced integrated circuits (chips) to improve product yield, even at advanced process nodes. These products are designed for fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM) and 3D NAND-flash memory chips. The company also develops, manufactures, and sells advanced packaging equipment to wafer assembly and packaging customers. Revenue from single wafer cleaning, Tahoe, and semi-critical cleaning equipment was $626.0 million (69.5% of total revenue) in 2025, $578.9 million (74.0% of total revenue) in 2024, and $403.9 million (72.4% of total revenue) in 2023. Revenue from ECP (front-end packaging), furnace, and other technologies was $199.6 million (22.1% of total revenue) in 2025, $151.1 million (19.3% of total revenue) in 2024, and $103.4 million (18.5% of total revenue) in 2023. Revenue from advanced packaging (excluding ECP), services, and spares was $75.8 million (8.4% of total revenue) in 2025, $52.2 million (6.7% of total revenue) in 2024, and $50.5 million (9.1% of total revenue) in 2023. Selling prices for its tools generally range from $0.5 million to over $5 million. The company estimates its current product portfolio addresses approximately $21 billion of the 2025 global wafer fab equipment (WFE) market.