Tower Begins High-Volume Shipments of Laser-Integrated Optical Engines for AI Interconnect
TSEM has more than doubled off its 52-week low of $64.83.
Summary
Tower Semiconductor and NewPhotonics announced high-volume shipments of laser-integrated optical engine PICs targeting 800G to 1.6T AI interconnect. The products use Tower's PH18DA silicon photonics platform with monolithic integration of lasers, SOAs, modulators, and detectors. Volume production of the NPG102 PIC is underway, with 6.4T NPC505 chipsets slated for 1H27. This follows Tower's $3B Japan expansion announced in July, which included silicon photonics capacity. The milestone validates Tower's SiPho roadmap and positions it in the fast-growing AI optical interconnect market, though revenue contribution is not yet quantified.
At the time of this announcement, TSEM was trading at $208.56 on NASDAQ in the Technology sector, with a market capitalization of approximately $22.8B. The 52-week trading range was $64.83 to $319.94. This news item was assessed with positive market sentiment and an importance score of 7 out of 10. Source: GlobeNewswire.