ASML Teams With Nvidia, Intel, TSMC on Larger-Chip EUV Tools
NVDA sits 40% above its 52-week low of $164.07.
Summary
ASML is collaborating with major chipmakers including Nvidia, Intel, TSMC, and Samsung to develop larger-mask High NA EUV tools capable of producing bigger data center chips. The move addresses a current limitation where High NA tools use smaller masks, restricting chip size. SK Hynix is evaluating joining the consortium for 12-inch masks, targeting 2028 for High-NA EUV DRAM production. TSMC plans High NA in advanced-node high-volume production from 2030, while Samsung targets 2028 for DRAM. ASML expects a pilot line by 2031 and high-volume readiness by 2033, with a projected 40% productivity gain. This development is strategically important for Nvidia, whose data center chips are at the size limit of current EUV tools, and for Intel, which already uses High NA for laptop chips. The collaboration signals industry-wide adoption of next-generation lithography, potentially boosting ASML's long-term tool demand and enabling larger, more powerful AI chips.
At the time of this announcement, NVDA was trading at $229.49 on NASDAQ in the Technology sector, with a market capitalization of approximately $5.6T. The 52-week trading range was $164.07 to $236.54. This news item was assessed with positive market sentiment and an importance score of 7 out of 10. Source: Reuters.