Applied Materials and Intel Team Up on Next-Gen AI Chipmaking
AMAT has more than doubled off its 52-week low of $203.4.
Summary
Applied Materials and Intel announced a deepened collaboration to develop next-generation AI chipmaking technologies, including advanced transistors, interconnects, and packaging for Foveros-based 3D stacking. The work will span Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Hillsboro, Oregon. This follows Applied's recent partnership expansion with Besi at the EPIC Center and its $5B India investment, reinforcing its AI-driven growth strategy. The collaboration strengthens Applied's position in the AI semiconductor equipment market and signals Intel's commitment to advanced packaging. Premarket reaction was modest: AMAT +1.3%, INTC +0.8%.
At the time of this announcement, AMAT was trading at $547.00 on NASDAQ in the Technology sector, with a market capitalization of approximately $430.4B. The 52-week trading range was $203.40 to $739.67. This news item was assessed with positive market sentiment and an importance score of 7 out of 10. Source: Seeking Alpha.